SanDisk mDOC H3
SanDisk mDOC H3 brings advanced boot and storage capabilities for a wide variety of platforms including mobile handsets, GPS devices and portable media players. Available up to 4GB and in various form factors, OEMs can access the latest, cost-effective NAND flash technologies and substantially reduce integration and qualification efforts.

mDOC H3 offers designers data storage and execute-in-place (XIP) boot capabilities in one device. Utilizing industry standard NOR-like interface together with patented TrueFFS® flash management technology, mDOC H3 provides a reliable and cost effective solution, eliminating the need for a separate boot device.

Platform design fit solution mDOC features small FBGA discrete, MCP and POP (with LP DRAM) packages, with a wide range of capacities from 128MB to 4GB, making it a solution for all platform configurations. mDOC products feature the same ball-out, power management and hardware and software interface for all capacities.

SanDisk iNAND with leading SD interface and JEDEC standard package and ball-out compatibility, eases integration of high-capacity storage in handsets and other applications including GPS, MP3 and PMP, available up to 8GB.

iNAND
Mass storage
High-capacity embedded flash storage in a small, low-cost, JEDEC compatible package ball-out with proven reliability and easy upgradeability to meet the increasingly stringent requirements of today's storage-hungry applications.

Industry-standard interface
SanDisk iNAND uses industry-standard serial SD interface which offer seamless hardware and software integration, with a low ball-out count for designs with tight routing (such as mobile phones and GPS devices) to minimize design risk and ensure backward compatibility.

Multi-Chip-Packages (MCPs)
SanDisk iNAND MCP is customized to meet high capacity platform needs with MCPs using LP-DRAM, NAND flash and iNAND for mass storage with an SD interface in a single package. This simplifies layout and saves valuable board space in mobile phones.